|
技术要求 Technical requirements
- 高功率密度
-Compactness with high power density
- 强环境适应性(高低温/振动/盐雾等)
-Harsh Environmental Adaptation
- 高可靠性与长寿命
-High reliability & long lifetime
技术方向 Technical Direction
- 新型宽禁带功率芯片封装技术
-Hybrid Packaging using emerging wide band-gap power chips
- 新型DBC结构和芯片布局设计
-Novel design of DBC and chips layout
- 直接冷却和双面冷却结构设计
-Novel thermal management design, including direct-cooling and double-sided cooling
- 集成的智能驱动保护电路
-Integrated with specially-designed drive & protection circuits to make IPMs
   
技术成果 Technical achievements

1200V/400A IGBT,Using novel DBCs
 
2in1 and 6in1 1200V/450A direct-cooling IGBTs
 
Two IPMs 1200V/450A, with conventional-cooling & direct-cooling
|