技术要求  Technical requirements

• 高功率密度
  　  -Compactness with high power density
• 强环境适应性(高低温/振动/盐雾等)
  　  -Harsh Environmental Adaptation
• 高可靠性与长寿命
  　  -High reliability & long lifetime

技术方向  Technical Direction

• 新型宽禁带功率芯片封装技术
  　  -Hybrid Packaging  using emerging  wide band-gap power chips　
• 新型DBC结构和芯片布局设计
  　  -Novel design of DBC and chips layout
• 直接冷却和双面冷却结构设计
  　  -Novel thermal management design, including direct-cooling and double-sided cooling
• 集成的智能驱动保护电路
  　  -Integrated with specially-designed drive & protection circuits to make IPMs

技术成果  Technical achievements

1200V/400A IGBT,Using novel DBCs

2in1 and 6in1 1200V/450A direct-cooling IGBTs

Two IPMs 1200V/450A, with conventional-cooling & direct-cooling